• Book this instrument
• Error report and suggestions for improvement
• Training request
  Short introduction necessary before use.

General information:

Plasma systems can be used for cleaning and activation of surfaces. Etching and coating is also feasible. Gas in a low pressure chamber is excited by a supply of energy. Oxygen and ambient air are the gases used in our plasma system, but one other type of gas can be installed at demand.

Practically every material can be cleaned with plasma. The surface is physically cleaned by ion bombardment, and chemically cleaned by the ionized gas. UV radiation helps breaking down long-chain complex carbon compounds.

Oxygen plasma creates radical sites on the surface, leaving it hydrophilic. This activation could be used as e.g. pretreatment before gluing.

Etching of plastics, semiconductors or glass can be done with a reactive process gas.

Coating of e.g metals, glass and ceramics is also possible. Introducing a monomer into the chamber results in it being atomized and deposited on the surface.