Kim Robert Bjørk Tekseth
Publikasjoner
2021
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Mürer, Fredrik Kristoffer;
Madathiparambil, Aldritt Scaria;
Tekseth, Kim Robert Bjørk;
Di Michiel, Marco;
Cerasi, Pierre;
Chattopadhyay, Basab.
(2021)
Orientational mapping of minerals in Pierre shale using X-ray diffraction tensor tomography.
IUCrJ
Academic article
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Mürer, Fredrik Kristoffer;
Chattopadhyay, Basab;
Madathiparambil, Aldritt Scaria;
Tekseth, Kim Robert Bjørk;
Di Michel, Marco;
Liebi, Marianne.
(2021)
Quantifying the hydroxyapatite orientation near the ossification front in a piglet femoral condyle using X-ray diffraction tensor tomography .
Scientific Reports
Academic article
2020
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Olufsen, Sindre Nordmark;
Tekseth, Kim Robert Bjørk;
Breiby, Dag Werner;
Clausen, Arild Holm;
Hopperstad, Odd Sture.
(2020)
A technique for in situ X-ray computed tomography of deformation-induced cavitation in thermoplastics.
Polymer testing
Academic article
Tidsskriftspublikasjoner
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Mürer, Fredrik Kristoffer;
Madathiparambil, Aldritt Scaria;
Tekseth, Kim Robert Bjørk;
Di Michiel, Marco;
Cerasi, Pierre;
Chattopadhyay, Basab.
(2021)
Orientational mapping of minerals in Pierre shale using X-ray diffraction tensor tomography.
IUCrJ
Academic article
-
Mürer, Fredrik Kristoffer;
Chattopadhyay, Basab;
Madathiparambil, Aldritt Scaria;
Tekseth, Kim Robert Bjørk;
Di Michel, Marco;
Liebi, Marianne.
(2021)
Quantifying the hydroxyapatite orientation near the ossification front in a piglet femoral condyle using X-ray diffraction tensor tomography .
Scientific Reports
Academic article
-
Olufsen, Sindre Nordmark;
Tekseth, Kim Robert Bjørk;
Breiby, Dag Werner;
Clausen, Arild Holm;
Hopperstad, Odd Sture.
(2020)
A technique for in situ X-ray computed tomography of deformation-induced cavitation in thermoplastics.
Polymer testing
Academic article
Formidling
2019
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Academic lectureAasmundtveit, Knut; Tekseth, Kim Robert Bjørk; Breiby, Dag Werner; Nguyen, Hoang-Vu. (2019) High-energy X-ray Tomography for 3D Void Characterization in Au–Sn Solid-Liquid Interdiffusion (SLID) Bonds. IMAPS Europe 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) , Pisa 2019-09-17 - 2019-09-19